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Absolics Inc. Verified
Semiconductor Manufacturing, Advanced Materials, Electronics

Staff Engineer - Advanced Packaging Multiphysics Physics Modeling

Covington, GAOnsiteFull TimeStaff$90,000–$150,000 /yrPosted 1 month agoVisa sponsorship available

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Required skills

  • Multiphysics
  • Advanced Packaging
  • Mechanical-Electrical Co-Simulation
  • stress
  • warpage
  • fatigue
  • delamination
  • cracking
  • SeWaRe
  • signal integrity

Nice to have

  • panel level packaging
  • system-level co-simulation
  • board
  • die
  • DOE
  • statistical methods

Role summary

Staff Engineer specializing in Advanced Packaging Multiphysics Physics Modeling for Mechanical-Electrical Co-Simulation. This role involves owning the simulation, modeling, and interpretation of Multiphysics behavior in advanced packaging architectures. Responsibilities include building and validating predictive models for mechanical (stress, warpage, fatigue, delamination, cracking, SeWaRe) and electrical (signal/power integrity, thermal-electrical coupling) performance. The engineer will translate simulation outputs into design rules and make go/no-go decisions for process and product teams, focusing on FEA, material characterization, failure mode prediction, and co-optimization of RDL/buildup layers. Strong collaboration with physical failure analysis and reliability testing is key.

Role Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling (Mechanical- Electrical Co-Simulation)

Job Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling

Location: Covington, GA

Job Type: Full-Time

Job Description:

This role owns the simulation, modeling and interpretation of Multiphysics behavior across advanced packaging architectures from die level interconnects through buildup layers to system-level integration. The engineer will build and validate predictive models for mechanical (stress, warpage, fatigue, delamination, cracking, SeWaRe) and electrical (signal/power integrity, thermal-electrical coupling) performance, translating simulation output into design rules and go/no-go decisions for process and product teams. Core work spans finite element analysis (FEA) of interlayer/interface stresses, material characterization and constitutive modeling, failure mode prediction (crack initiation, delamination, via cracking, SeWaRe type reliability failures), and RDL/buildup layer mechanical-electrical co-optimization, closing the loop between simulation predictions and physical failure analysis/reliability test data.

Required Skills:

  • FEA modeling (ANSYS, Abaqus, or COMSOL) for stress/strain, thermos-mechanical and fracture mechanics analysis in multilayer stacks
  • Interface/interlayer stress and delamination modeling (cohesive zone modeling, VCCT, traction-separation laws)
  • Material property characterization, and modeling for polymers (dielectrics, mold compounds) metals, (Cu, Ti seed), and glass/ceramic substrates – CTE mismatch, viscoelasticity, plasticity
  • Working knowledge of RDL buildup layer, and interposer architectures (organic, glass core) and their process induced stress states
  • Failure mode analysis tied to package reliability (thermal cycling, SeWaRe, drop/shock, warpage) with ability to correlate simulation to physical failure analysis (SEM, CSAM, cross-section)
  • Electrical performance simulation basics – signal/power integrity or coupled electro-thermal-mechanical modeling
  • Strong grasp of semiconductor packaging unit processes (lithography, plating, etch) and how they introduce residual stress
  • Scripting/automation for parametric studies (Python, MATLAB, or APDL/Abaqus scripting)
  • Ability to translate simulation results into actionable design rules for process/product engineering teams

    • Preferred Skills

  • Experience with panel level packaging reliability prediction
  • Exposure to system-level (board + package + die) co-simulation
  • DOE/Statistical methods for correlating simulation with experimental reliability data
  • Familiarity with glass core interposer or 2.5D/3D heterogenous integration mechanics
  • Experience with machine learning assisted surrogate modeling for faster design space exploration

    • Education:

  • PhD or equivalent industry experience in mechanical engineering materials science, or semiconductor device physics

    • Benefits:

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

    • SALARY:

  • $90,000 – $150,000
    • Ready to apply?
    You'll be redirected to Absolics Inc.'s application page.

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