
Sensing HW Data Collection Systems - Mechanical Engineer
Required skills
- mechanical engineering
- analytical skills
- materials
- manufacturing processes
- 3D CAD modeling
- 2D manufacturing drawings
- low volume system manufacturing
Nice to have
- IQC
- IPQC
- tolerance analysis
- DFM/DFA
- GD&T
- Siemens NX
Role summary
Apple's Data Collection Systems team is seeking a Mechanical Engineer to design and develop hardware for cutting-edge sensing technologies integrated into products like iPhone, iPad, and Apple Watch. This role involves partnering with cross-functional teams to realize mechanical designs for early-stage data collection systems, assisting with technical requirements, design detailing, prototyping, fabrication, and low-volume manufacturing. The ideal candidate possesses strong mechanical engineering fundamentals, proficiency in 3D CAD, and experience with manufacturing processes. Preferred qualifications include exposure to real-world manufacturing quality control, Siemens NX, PCB design, electronics integration, and sensing technologies.
Description
In this role you will partner with cross-functional teams such as electrical, optical, embedded firmware, and software algorithm engineers to realize mechanical designs that integrate new technologies into systems for early-stage data collection. You will assist in setting technical requirements, design detailing, prototyping, fabrication, and the mechanical build process of low volume system manufacturing.
Minimum Qualifications
Strong mechanical engineering fundamentals with good analytical skills and familiarity selecting materials and manufacturing processes based on engineering requirements Proficiency in 3D CAD modeling and generating 2D manufacturing drawings Minimum requirement of a bachelors degree
Preferred Qualifications
Exposure to real-world manufacturing and quality control processes including IQC, IPQC, tolerance analysis, DFM/DFA, and GD&T. Experience with Siemens NX and and familiarity with design, fabrication and assembly of flexible or rigid printed circuit boards Hands-on experience integrating electronics, sensors or cameras within tight packaging or thermal constraints Understanding of optical and imaging systems, force, touch, or inertial sensing technologies Strong written and verbal communication skills with the ability to interact with management, team members and external vendors MS in mechanical engineering with proven industry or internship experience
Sample Apple interview questions
- 1
Design a typeahead box for a search engine
system designmedium - 2
Design a rate limiter
system designmedium - 3
Architect a key-value store for distributed systems.
system designmedium - 4
Design a system to schedule jobs in a distributed environment
system designmedium - 5
What is an API and how does it work?
technicalmedium
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