Artificial Intelligence, Internet of Things (IoT), PropTech, Space Management, Analytics

PCB Quality Engineer

Mountain View, CAOnsiteFull Time$215,000–$265,000 /yrPosted 1 month agoVisa sponsorship available

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Required skills

AI accelerator
PCB
package substrates
AI
embedded passives/actives
inorganic core substrates
novel thermal solutions
high-layer-count boards
flip-chip organic substrates
yield

Nice to have

technology roadmap
manufacturability
partnering
manufacturing partners
product architectures
silicon meets the system

Role summary

This role is for an advanced PCB Quality Engineer responsible for the technology roadmap, manufacturability, and quality of advanced PCBs and package substrates for AI accelerator silicon. The engineer will drive technology direction, develop and qualify new materials and processes with vendors, and collaborate with cross-functional teams. Key responsibilities include leading DFM/DFx reviews, owning supplier quality, defining quality standards, conducting failure analysis, and supporting reliability qualifications. The role requires a BS/MS in a relevant engineering field and 5+ years of experience in PCB/substrate technology development, DFM, or manufacturing/supplier quality.

ABOUT THE ROLE

Own the technology roadmap, manufacturability, and quality of the advanced PCBs and package substrates that carry our AI accelerator silicon. You'll drive where our substrate and PCB technology is headed — embedded passives/actives, inorganic core substrates, and novel thermal solutions — while making sure complex, high-layer-count boards and flip-chip organic substrates are designed to build cleanly, at yield, and to spec. Partnering across packaging, thermal, and systems teams and directly with our substrate and PCB manufacturing partners, you'll develop and qualify the new materials, structures, and processes that enable next-generation product architectures — and protect product quality where the silicon meets the system.

WHAT YOU'LL DO

Drive the advanced substrate and PCB technology roadmap — including embedded passive/active integration and inorganic core substrates — aligned to our AI accelerator product needs

Develop and qualify new materials, structures, and processes with substrate and PCB vendors, taking them from evaluation through production readiness

Cowork with cross-functional teams (packaging, SI/PI, thermal, mechanical, systems) to improve and enable new product architectures — with focus on passive/active embedding, novel thermal solutions, and improved SI/PI and mechanical behavior for assembly and reliability

Lead DFM/DFx reviews for high-layer-count PCBs and organic package substrates (flip-chip BGA / ABF) — catching manufacturability, yield, and reliability risks before tape-out to the fab

Own substrate and PCB supplier quality: qualify suppliers, drive PPAP/first-article and process capability, and hold partners to spec through NPI and volume ramp

Define quality standards and acceptance criteria (IPC and internal) that gate build, and drive defect and failure analysis (cross-section, metrology, electrical) to root cause with corrective actions at the supplier

Support reliability qualification (thermal cycling, HAST, etc.) and use statistical methods (SPC/DOE) to monitor and improve process quality across suppliers

Build the DFM guidelines, checklists, and quality processes that scale with the program from prototype through production

WHAT WE'RE LOOKING FOR

BS/MS in Electrical, Materials, Mechanical, or Manufacturing Engineering plus 5+ years in advanced PCB/substrate technology development, DFM, or manufacturing/supplier quality for complex electronics

Hands-on experience developing and qualifying advanced substrate/PCB technologies — embedded passives/actives, inorganic and organic core substrates, ABF build-up, flip-chip BGA — including materials, structures, and process development with vendors

Strong grasp of advanced PCB and substrate fabrication processes (lamination, drilling/laser via, plating, ABF build-up, flip-chip BGA) and where they fail

Experience partnering cross-functionally (packaging, SI/PI, thermal, mechanical, systems) to enable new product architectures, including embedded components and novel thermal solutions

Supplier quality depth — qualification, PPAP/first-article, process capability, and driving corrective action with fab/substrate partners

Fluency in IPC standards (e.g., IPC-6012 / IPC-A-600 or substrate equivalents) and quality acceptance criteria

Failure-analysis skills: cross-section, metrology, and electrical debug to root-cause defects

Full compensation packages are based on candidate experience and relevant certifications.

California pay range$215,000—$265,000 USD

Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.

Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.

Export Controls

Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.

Equal Opportunity

DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.

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