Package Layout Engineer
Required skills
- Package Layout Design Engineer
- Signal Integrity
- Power Integrity
- Packaging
- substrate layouts
- package architecture
- Allegro X APD
- IC package substrates
- organic materials
- analog
Nice to have
- IC packaging
- substrate layout design
- system-level validation
- Cadence Integrity 3DIC
- Expedition Package Designer
- Pads Layout
Role summary
Lightmatter is seeking a Package Layout Design Engineer to develop next-generation products. This role involves creating IC package substrate layouts, optimizing package architectures, and collaborating with suppliers to meet stringent signal integrity, power integrity, and manufacturability requirements. The engineer will design layouts incorporating analog and digital elements, support SI/PI engineers with test routes, and ensure timely, error-free tape-outs. The position requires proficiency in Allegro X APD and an understanding of IC package substrates, with preferred experience in advanced packaging, scripting, and system-level validation tools.
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.
Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!
If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.
Lightmatter is (re)inventing the future of computing with light!
About This Role
Lightmatter is looking for a Package Layout Design Engineer to drive the next generation products from concept to development. You will be part of the Signal Integrity, Power Integrity and Packaging team, tasked with delivering substrate layouts that support the package architecture from concept, through design optimization and completion, meeting stringent signal integrity, power integrity, and design for manufacturing requirements. This position offers a unique opportunity to work on new package architectures by solving complex interactions across digital, analog and photonics domains.
Responsibilities
Qualifications
Preferred Qualifications
We offer competitive compensation. The base salary range for this role determined based on location, experience, educational background, and market data.
Salary Range: total compensation goes beyond base salary, it also includes a new hire equity grant, annual performance-based equity, and other rewards that recognize your impact and contribution.$157,000—$176,000 USDBenefits
Benefits eligibility may vary depending on your employment status and location. Lightmatter recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.
Export Control
Candidates should have capacity to comply with the federally mandated requirements of U.S. export control laws.
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