
Manager, Mechanical Engineering - Electronics Packaging
Required skills
- ruggedized electronics packaging
- structural
- thermal
- vibration
- EMI/EMC
- IPC Class 3
- EMI shielding
- grounding
- environmental sealing
- connector selection
Nice to have
- power systems
- environmental qualification
- production release
- security clearance
Role summary
Marotta Controls is seeking a Manager, Mechanical Engineering - Electronics Packaging to lead day-to-day mechanical design activities for ruggedized electronics packaging within the PAS business unit. This role involves team management, program execution, and ensuring adherence to structural, thermal, vibration, EMI/EMC, and IPC Class 3 design standards. The manager will also contribute to developing and maintaining mechanical engineering procedures and standards. The position reports to the Director, Mechanical Engineering, PAS and requires a Bachelor's degree in Mechanical, Aerospace, or related discipline with 8+ years of aerospace/defense experience and 3+ years of leadership experience. The role is based in Parsippany, NJ.
Manager, Mechanical Engineering – Electronics Packaging Design
(PAS)
JOB SUMMARY OF THE POSITION
The Engineering Manager leads day-to-day execution of mechanical design activities supporting ruggedized electronics packaging within the PAS business unit.
This role is responsible for team management, program-level execution, and adherence to established Marotta-internal structural, thermal, vibration, EMI/EMC, and IPC Class 3 design standards. Additionally, this role participates in the development and maintenance of mechanical engineering procedures, reference manuals, and design standards.
Reports to: Director, Mechanical Engineering, PAS. JOB SPECIFICATION
Scope of Responsibility:
- Direct management of 10+ mechanical engineers.
- Program-level electronics packaging design execution accountability.
- Enforcement of established design standards and margin policies.
- Support of design, integration, and qualification activities under Senior Manager/Director oversight.
- Engineering & Technical Leadership
- Assign and manage packaging-engineering design tasks and resources.
- Ensure design compliance with customer/ contractual performance requirements.
- Oversee execution of thermal, structural, and vibration/shock analysis.
- Oversee ruggedized electronics design (Thermal, structural, CCA, PCB, DFM, etc.).
- Ensure IPC Class 3 mechanical integration practices.
- Ensure EMI shielding and grounding implementation as appropriate.
- Ensure application of environmental sealing techniques as appropriate.
- Drive disciplined execution through gated reviews (SRR, PDR, CDR, TRR, FCA/PCA).
- Participate and drive closure in failure investigation, root cause analysis, and corrective action (FRACAS) activities.
- Support proposal efforts with credible technical, labor, and schedule inputs and risk assessments.
- Maintain AS9100 compliance and audit readiness within the mechanical discipline.
- Spearhead electronic packaging-related issue resolution.
- Escalate systemic risks appropriately.
- Process & Standardization:
- Enforce mechanical engineering procedures and documentation controls.
- Ensure AS9100 compliance at team level.
- Institutionalize lessons learned into formal design guidance.
- Improve repeatability, documentation quality, and configuration control discipline.
- Ensure analysis assumptions and modeling practices are standardized and traceable.
- Additionally, Participate in development, maintenance, and enforcement of:
i. Mechanical engineering procedures and work instructions
ii. Electronics packaging design standards
iii. Engineering design reference manuals
iv. Design review checklists and documentation controls
- Additionally, Participate in development, maintenance, and enforcement of:
- Team Development:
- Conduct performance reviews and development planning.
- Mentor and develop mechanical engineers in technical rigor and execution discipline.
- Provide clear performance expectations and structured feedback.
- Foster cross-functional collaboration.
- Bachelor’s degree in Mechanical, Aerospace, or related discipline.
- 8+ years aerospace/defense experience.
- 3+ years leadership/management experience preferred.
- Demonstrated experience designing electronics packaging for harsh environments (vibration, shock, thermal cycling).
- Experience with structural, vibration, and shock design.
- Experience with thermal management design (conduction, convection, radiation cooling methods).
- Working knowledge of IPC Class 3 requirements for CCA/PCB design and manufacturability.
- Familiarity with EMI shielding, grounding, and environmental sealing techniques.
- Familiarity with connector selection for aerospace applications.
- Working knowledge of thermal, structural, and vibration analysis principles; familiarity with FEA tools.
- Proficiency with 3D CAD systems (PTC Creo preferred).
- Working knowledge of environmental qualification standards (MIL-STD-810, MIL-STD-461, DO-160, etc.).
- Strong written and verbal communication skills.
- Must be a U.S. citizen.
- Master’s degree in Mechanical, Aerospace, or related engineering discipline.
- Direct experience with flight-critical control actuation systems and power systems.
- Experience leading programs through environmental qualification and production release.
- Active, or eligible for, U.S. security clearance.
- Electronic assembly designs meet cost, schedule, and technical commitments.
- Strong customer confidence and successful qualification outcomes.
- Late-stage test failures and electronics-packaging-related rework are reduced.
- Engineering documentation is complete, controlled, and audit-ready.
- Effective collaboration between design, integration, and production teams.
- Team members demonstrate growth in technical depth and execution quality.
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