Senior Field Application Engineer
Required skills
- Wi-Fi HaLow
- 802.11ah
- embedded C
- RTOS
- Linux
- wireless hardware
- RF characteristics
- IEEE 802.11 Wi-Fi protocol
- chip integration
- HW/RF debugging
Nice to have
- pre-sales activities
- technical value proposition
- reference designs
- mass production
- sales team
- design-wins
Role summary
Morse Micro is seeking a Senior Field Application Engineer to support customers in their application concept, software/hardware system design, chip/module bring-up, and mass production. This role focuses on Wi-Fi HaLow chip development and support, acting as the primary customer contact. Responsibilities include pre-sales support, developing reference designs, assisting with design reviews and debugging, and documenting hardware and code for embedded systems, primarily wireless LAN. The ideal candidate has 4+ years of industry experience, expertise in embedded C, knowledge of RTOS, Linux, wireless hardware, and RF measurements, and strong communication and problem-solving skills.
Are you an experienced and innovative applications engineer with a passion for cutting-edge technology? Are you excited about the idea of working with a dynamic and fast-growing company? If so, then Morse Micro has the perfect opportunity for you!
As our Senior Field Application Engineer, you will be responsible for supporting customers from application concept, software/hardware system design, our chip/module bring-up, and mass production. You will be the first point of contact for our customers in the region. Your main focus will be on our Wi-Fi HaLow chip-related software/hardware/RF development and support.Location is flexible: Successful candidates may be based out of Irvine, San Jose, Pennsylvania or Boston.
Responsibilities include:
Partner with Sales as part of pre-sales activities to effectively communicate the technical value proposition of Morse Micro Products
Development of reference designs with Morse Micro’s chips and modules
Assist customers with software/hardware design review, bring-up, chip integration, and HW/RF related debugging and testing
Develop, document, and maintain hardware & code to showcase and demonstrate features of an embedded system, primarily focused on wireless LAN
Collaborate with internal and external customers to understand the details of specific use cases and translate this to technical requirements and documentation
Support internal and external customers with design & development activities
Partner with Sales as part of pre-sales activities to effectively communicate the technical value proposition of Morse Micro Products
Support US customers
Travel to customers as needed
What we’re looking for:
Field Application Engineer with a minimum of 4+ years of relevant industry experience
Excellent verbal & written communication skills
BSc or MSc in Electrical or Electronics Engineering or Computer Engineering
Expert in embedded C programming
Experience with RTOS and understanding of Linux development environments
Knowledge of wireless hardware
Understand bench measurements of RF characteristics.
Good understanding of the IEEE 802.11 Wi-Fi protocol
Strong problem-solving skills and thorough, methodical work style
Must be articulate in English and capable of producing clear and detailed documentation
Must be comfortable with interacting with customers in person and via conference calls
Cooperating with the R&D team for issue resolution
Working with the sales team to achieve design-wins and develop new accounts
Ability to travel up to 50% of the time, depending on customer activity/needs
What we offer:
Competitive salary + excellent stock option package
Opportunity to work at a cutting-edge startup company
Chance to make a significant impact on the future of wireless technology
Collaborative and supportive work environment
Who we are:
Morse Micro is Australia’s largest semiconductor company, building Wi-Fi HaLow (802.11ah) chips for the Internet of Things (IoT). We are a team of wireless experts who love to work hard, innovate & invent. Together, we are building the world’s lowest power Wi-Fi technology that will enable billions of IoT devices to connect securely to the internet. We are a global team with offices in Sydney, Picton & Melbourne (Australia), Irvine & Bay Area (USA), Bangalore (India), Cambridge (UK), Hangzhou & Shenzhen (China), Taipei (Taiwan) and Tokyo (Japan).
If you’re ready to help shape the future of IoT connectivity, please apply - This is your moment.
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