
Sr. Engineer, Package Design
Required skills
- MEMS
- CMOS
- semiconductor IC packaging
- package design
- qualification
- OSATs
- prototype
- test
- performance
- reliability
Nice to have
- thermal modeling
- mechanical modeling
- electrical modeling
- material characterization
- DMA
- TMA
Role summary
SiTime, a leader in precision timing solutions, seeks a Senior Semiconductor Package Engineer to design, develop, and qualify custom packaging for MEMS-based timing products. This role involves leading package design activities, managing overseas OSATs, and ensuring performance, reliability, and quality requirements are met. The ideal candidate has an M.S. or PhD. in Mechanical Engineering or Material Science with 5+ years of experience in semiconductor IC packaging, including knowledge of various package types and flip-chip technologies. Experience with CAD software and understanding of thermal, stress, and electrical considerations are important. The role offers a competitive compensation package including base salary, bonus, equity, and comprehensive benefits.
About SiTime
SiTime is the Precision Timing company.
Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.
Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com.
Job Summary
The Senior Semiconductor Package Engineer is responsible for the specification, design, development, and qualification of unique custom packaging technology for SiTime’s revolutionary MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules, all of which incorporate custom-designed MEMS and CMOS components. We value diverse experiences, perspectives, and career paths, and welcome candidates who are excited to contribute to our mission.
Responsibilities:
Qualifications & Requirements:
Desired Characteristics & Attributes:
Compensation:
At SiTime, we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.
In addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals—reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company’s future growth and success.
Benefits offered: 401k plan, health and wellness that includes medical, dental, vision, life, parental leave, legal services, and time off plans.
SiTime is an Equal Opportunity Employer. We treat each person fairly and we do not tolerate discrimination or harassment against anyone on the basis of any protected characteristics, including race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, pregnancy, political affiliation, protected veteran status, protected genetic information, or marital status or other characteristics protected by law. SiTime participates in the E-Verify program.
Learn More about SiTime: Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique.
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