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Semiconductors, Artificial Intelligence, Machine Learning

Global Supply Chain Manager, OSAT

TaiwanHybridFull TimeManager / HeadPosted 1 month ago

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Required skills

  • OSAT
  • semiconductor
  • supply chain
  • manufacturing
  • supplier management
  • flip-chip
  • wire bond
  • wafer-level packaging
  • Taiwan
  • negotiating

Nice to have

  • Mandarin fluency

Role summary

Tenstorrent is seeking a Global Supply Chain Manager for OSAT partnerships and backend manufacturing execution, based in Taiwan. The role requires 7+ years of semiconductor supply chain experience, understanding of OSAT workflows, and negotiation skills. Responsibilities include managing supplier relationships, coordinating production schedules, sourcing materials, and mitigating supply chain risks. Experience with ERP, PLM, and data visualization tools is expected. Mandarin fluency is a plus. This hybrid role involves regular travel and offers opportunities to learn about advanced AI hardware supply chains.

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Tenstorrent is building high-performance AI systems and the supply chain required to deliver them at scale. We are looking for a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out through final shipment.

This role is hybrid based out of Taiwan, with regular travel.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

  • Bring 7+ years of experience in semiconductor supply chain, manufacturing, or supplier management, along with a bachelor’s degree in Supply Chain, Engineering, or a related discipline.
  • Have a strong understanding of OSAT workflows, including flip-chip, wire bond, and wafer-level packaging, with hands-on experience working with Taiwan-based OSAT partners.
  • Are comfortable negotiating complex supplier agreements, pricing, tooling, or NRE costs and managing relationships across technical, commercial, and operational issues.
  • Are a clear, direct, and trusted communicator who can work effectively across global teams, suppliers, and North American and Asia-Pacific time zones; Mandarin fluency is a plus.
  • Are a structured, data-driven operator with experience using ERP systems such as SAP or Oracle, PLM systems, and reporting tools such as Tableau or Power BI, and you take ownership in ambiguous situations.

    • What We Need

  • Lead OSAT supplier relationships, QBRs, KPI reviews, escalations, and commercial negotiations while building trust and holding partners accountable.
  • Coordinate engineering builds, qualification lots, process readiness, yield ramps, demand, capacity, materials, and production schedules across OSAT partners.
  • Manage backend operations including bumping, assembly, burn-in, final test, and system-level test for advanced packaging and multi-die products.
  • Own substrate and critical-material sourcing, including capacity, pricing, tooling, lead-time risk, and high-density substrate requirements for HBM and AI compute products.
  • Resolve supply, quality, yield, logistics, and schedule risks while establishing reliable OSAT data, KPIs, and processes to support analytics and automation.

    • What You Will Learn

  • How advanced AI hardware moves from wafer fabrication through packaged silicon delivery.
  • How OSAT capacity, yield, quality, cost, and logistics decisions affect product availability.
  • How to manage strategic partnerships with leading semiconductor manufacturers across Asia.
  • How advanced packaging and multi-die products scale from qualification into volume production.

    • This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.

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