Senior Electronics Quality Engineer, Remote- Contract
Required skills
- IPC 610
- IPC 620
- PCB CAM
- Gerber Review
- SMT
- AOI
- Counterfeit Parts Detection
- AS6081
- Semiconductor Package Inspection
- C SAM
Nice to have
- 8+ years
- electronics quality
- CAM engineering
- failure analysis
- PCB assembly
- wire harness
Role summary
Seeking a Senior Electronics Quality Engineer for a remote contract role focused on ensuring the quality of electronic components and assemblies. This role involves detailed inspection and analysis of PCBs, SMT processes, counterfeit parts, and semiconductor packaging, aligning with industry standards like IPC 610/620 and AS6081. The engineer will also contribute to refining AI training datasets by providing high-quality input and analysis. Preferred qualifications include extensive experience in electronics quality, CAM engineering, or failure analysis, with specific certifications and hands-on skills in inspection tools and methodologies.
Role Title: Senior Electronics Quality Engineer
Role Type: Contract
Location: Remote
Required Skills:
IPC 610 & IPC 620 Inspection
PCB CAM & Gerber Review
SMT/AOI Defect Analysis
Counterfeit Parts Detection (AS6081)
Semiconductor Package Inspection (C SAM and X ray)
In this role, you'll apply your expertise to help train next-generation AI systems. Your work will shape how models learn, reason, and perform through high-quality, real-world input. No prior experience in AI is required — your domain knowledge is what matters.
Scope of Work:
Review and evaluate PCB CAM and Gerber files for manufacturability, quality, and compliance with industry standards.
Perform IPC 610 and IPC 620 visual inspections and provide detailed feedback on PCB assembly or wire harness builds.
Analyze and document surface mount (SMT) and automated optical inspection (AOI) defect types, including the identification and root cause analysis of AOI false calls.
Apply expertise in counterfeit electronic part detection aligned with AS6081 standards, delivering actionable insights for risk mitigation.
Conduct and interpret advanced semiconductor package inspections using C-SAM and X-ray imaging, including die inspection and MIL-STD-883 compliance checks.
Prepare concise, well-written reports and articulate findings verbally to both technical and non-technical stakeholders.
Collaborate with project leads to refine workflow processes and enhance training datasets for AI development.
Preferred Qualifications:
8+ years of hands-on experience in electronics quality, CAM engineering, or failure analysis, specifically within PCB assembly, wire harness, or semiconductor packaging domains.
Extensive expertise in IPC-A-610 and IPC/WHMA-A-620 inspection criteria; IPC CIS/CIT certification strongly preferred.
Demonstrated experience reviewing Gerber data and utilizing PCB CAM software for manufacturability and quality assurance.
Proficiency in SMT processes, AOI defect analysis, and remediation of false calls in automated inspection systems.
Direct involvement in counterfeit component screening per AS6081, with knowledge of risk indicators and mitigation strategies.
Hands-on skills with semiconductor inspection tools such as C-SAM and X-ray, alongside familiarity with MIL-STD-883 procedures.
Exceptional written and verbal communication skills, ensuring clarity in documentation and knowledge transfer.
Originally posted on Himalayas
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