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Semiconductor Manufacturing, Chip Design, Electronic Design Automation

Technical Program Manager

RemoteRemoteFull TimePosted 11 days agoVisa sponsorship available

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Required skills

  • wafer-scale photonic systems
  • technical program manager
  • semiconductor
  • hardware development
  • engineer
  • program manager
  • development to working hardware
  • advanced packaging
  • ASIC/SoC
  • system hardware

Nice to have

  • 2.5D/3D
  • chiplet
  • flip chip
  • multi-die packages
  • mechanical stress
  • thermal effects

Role summary

Seeking a hands-on Technical Program Manager to own programs for wafer-scale photonic systems, working closely with engineering teams from packaging to system bring-up. This role involves managing schedules, risks, and inter-team handoffs, with a focus on driving execution and understanding technical details. The ideal candidate has 8+ years in semiconductor or hardware development, with deep knowledge in advanced packaging or ASIC/SoC and system hardware. Experience with external partners is crucial. Preferred qualifications include expertise in advanced packaging techniques, chip-on-wafer assembly, photonic assemblies, reliability, advanced-node ASIC tape-outs, multi-die programs, system hardware bring-up, high-speed SerDes, data center hardware, and tools like Jira and Confluence.

What We're Looking For:

We're looking for technical program managers to own programs across our wafer-scale photonic systems. Each TPM owns one program and works embedded with the engineering team that carries most of it, from packaging and assembly to silicon and system bring-up. We have two openings.

This is a hands-on role. You'll own the schedule, the risks and the handoffs between teams, and you'll work in the technical details alongside the engineers. We want someone who gets things done themselves, not someone who only tracks status.

Ideal Background:

  • 8+ years in semiconductor or hardware development, as an engineer, a program manager or both, with programs taken from development to working hardware
  • Deep working knowledge of at least one of: advanced packaging and assembly, or ASIC/SoC and system hardware
  • Communicates clearly and directly with engineers, partners and leadership
  • Reads specifications closely and spots gaps, conflicts and missing owners
  • Action-oriented: builds plans and schedules that engineers actually use, and drives them to done
  • Experience running work with external partners (foundries, OSATs, IP or design-services vendors)

    • Nice to Have:

  • Advanced packaging (2.5D/3D, chiplet, flip chip), including complex multi-die packages
  • Experience with chip-on-wafer (CoW) assembly, including mechanical stress and thermal effects
  • Photonic, optoelectronic or other heterogeneous-material assemblies
  • Reliability qualification, failure analysis, test vehicles and DOEs
  • Advanced-node ASIC/SoC tape-outs and work with third-party IP or design-services partners
  • Multi-die, chiplet or MCM programs, including chip-package co-design
  • System hardware (boards, power, thermal, mechanical) through bring-up
  • Optical I/O or high-speed SerDes programs
  • Data-center or OCP-style hardware
  • Experience with Jira and Confluence
    • Ready to apply?
    You'll be redirected to Volantis Semiconductor's application page.

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